Automatic cassette-to-cassette loading production system up to 300 mm
始于1974年，原子层沉积（ALD）技术的引领者
新闻稿、新闻和事件
Jun 10, 2013
ESPOO, Finland, 10th June, 2013 – Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer, reports excellent process results for copper diffusion barrier deposition. ALD materials for copper diffusion barriers were investigated in the project ESiP (Efficient Silicon Multi-Chip System-in-Package Integration – Reliability, Failure Analysis and Test), running from May 2010 to June 2013.了解更多
Apr 9, 2013
ESPOO, Finland, 9th April, 2013 – Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM™ 300 ALD cluster tool has been selected by a key customer in Asia for new memory applications. The 300 mm cluster design is based on the company’s long-term top product, the fully automated, multifunctional PICOPLATFORM™ ALD deposition unit for parallel, simultaneous execution of several different processes for high-k and metal/metal nitride films.了解更多
什么叫原子层沉积（ALD）技术？ |
PICOSUN R系列
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PICOSUN P系列
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原子层沉积（ALD）是一项先进的薄膜沉积技术，被广泛应用于制造超薄的、高度均匀和保形性的薄膜。 |
PICOSUN™ R-系列原子层沉积（ALD）系统专门针对研究、生产开发和试生产进行优化。用途广泛的反应器设计使 2-8’’（50-200 毫米）的晶片、三维物体，以及多孔基片上均可进行沉积。 |
PICOSUN™ P-系列原子层沉积（ALD）系统是完全按照ALD原理的需求而专利设计，可提供极高的工艺速度，极低的拥有成本，为ALD工业化生产工具设定了一个崭新的标准。 |
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