Press Releases
|
10.06.2013: Top quality Cu diffusion barriers from Picosun in the ENIAC JU project ESiP ESPOO, Finland, 10th June, 2013 – Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer, reports excellent process results for copper diffusion barrier deposition. ALD materials for copper diffusion barriers were investigated in the project ESiP (Efficient Silicon Multi-Chip System-in-Package Integration – Reliability, Failure Analysis and Test), running from May 2010 to June 2013. |
|
|
09.04.2013: Picosun’s high performance 300-mm ALD cluster tool enters new generation memory market ESPOO, Finland, 9th April, 2013 – Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer, reports that its PICOPLATFORM™ 300 ALD cluster tool has been selected by a key customer in Asia for new memory applications. The 300 mm cluster design is based on the company’s long-term top product, the fully automated, multifunctional PICOPLATFORM™ ALD deposition unit for parallel, simultaneous execution of several different processes for high-k and metal/metal nitride films. |
|
|
05.03.2013: Picosun presents continuous ALD for moisture and oxygen barriers ESPOO, Finland, 5th March, 2013 – Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer, and VTT Technical Research Centre of Finland report notable progress in continuous ALD technology. The water vapour and oxygen transmission rates measured from polymer films coated with thin ALD Al2O3 layer in Picosun’s new roll-to-roll ALD deposition chamber were on a par with the values obtained with similar coating in a batch ALD process, thus proving Picosun’s design for continuous ALD solution the frontrunner in producing barrier films on flexible substrates – one of the most sought-after ALD applications of today. |
|
|
28.01.2013: Picosun ALD fills the gap in MEMS devices ESPOO, Finland, 28th January, 2013 – Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer expands its central role in the field of European semiconductor manufacturing by taking part in a yet new international R&D project, Lab4MEMS. The project started 1st January, 2013 and will run for two and a half years. Lab4MEMS is Picosun’s fifth simultaneous European funded R&D project and strengthens directly the company’s core competencies in the field of semiconductors, IC (integrated circuits) and electronics. |
|
|
19.12.2012: Picosun launches new Picofloat™ particle coating system ESPOO, Finland, 19th December, 2012 – Picosun Oy, leading atomic layer deposition (ALD) equipment manufacturer announces the launch of new Picofloat™ particle coating system. The new design will further complement Picosun’s versatile ALD equipment range and make thin film coatings on powder and particle samples even easier than before. |
|
|
19.11.2012: Picosun revolutionizes roll-to-roll ALD technology ESPOO, Finland, 19th November, 2012 – Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer expands its product portfolio by introducing new, innovative Picosun™ roll-to-roll ALD coating system (patent pending). |
|
|
05.11.2012: Picosun the first Finnish company to join China-Finland Nano Innovation Center in Suzhou ESPOO, Finland, and SUZHOU, China, 5th November, 2012 – Picosun Oy, the leading Atomic Layer Deposition (ALD) equipment manufacturer is joining the China-Finland Nano Innovation Center, opened 2nd November, 2012 by the honourable guests of H.E. Mr. Wan Gang, China’s Minister of Science and Technology, and H.E. Mr. Jyri Häkämies, Finland's Minister of Economic Affairs. |
|
|
16.10.2012: Picosun's co-organizes 2nd China ALD Conference ESPOO, Finland, and SHANGHAI, China,16th October, 2012 – Picosun Oy, leading atomic layer deposition (ALD) equipment manufacturer has co-organized the 1st International Conference on ALD Applications and 2nd China ALD Conference in cooperation with Fudan University, one of China’s top universities. The event took place in Shanghai 15th – 16th October at Fudan University’s premises. |
|
|
30.08.2012: Picosun's new Picoflow™ diffusion enhancer expands the borders of ALD ESPOO, Finland, 30th August, 2012 − Picosun Oy, Finnish, globally operating manufacturer of top-quality Atomic Layer Deposition (ALD) systems reports excellent deposition results with its new Picoflow™ diffusion enhancer feature. At customer sites in Asia and Europe, ultra-high conformality and uniformity ALD metal oxide thin films were deposited on extremely challenging high aspect ratio (HAR) trenches on silicon wafers and complicated microchannel structures on silicon chip. |
|
|
30.07.2012: Record fiscal year for Picosun ESPOO, Finland, 30th July, 2012 − Picosun Oy, Finnish, globally operating manufacturer of top level Atomic Layer Deposition (ALD) systems has reached again a record fiscal year (May 1, 2011 – April 30, 2012). This is the sixth consecutive profitable fiscal year for the company and an “absolute success”, describes Mr. Kustaa Poutiainen, the CEO and Chairman of the Board of Picosun in the company’s Annual Shareholders’ Meeting held in Kirkkonummi, Finland today. |
» Archive