P-1000

Basic features

Substrate size and type 450 mm wafers in batch up to 40 pieces
300 mm wafers in batch up to 80 wafers
200 mm wafers in batch, 12 x 25 pieces
156 mm x 156 mm solar Si wafers in batches of 800/1000 wafers/run (both sides/ back-to-back)
Up to 400x600 mm glass wafers in batches of 30/50 wafers/run (both sides/ back-to-back)
3D objects (450x450x650 mm), e.g. steel, aluminum, plastic, silverware
Powder and particle substrates
Microchannel plates and through-porous substrates
High-aspect ratio substrates (1000:1)
   
Process temperature 50 – 500 °C
   
Substrate loading options Pneumatic loader, robotic loader
   
Precursors Liquid, solid, gas, ozone
Level sensors, cleaning and refill service
Up to 12 sources with 8 separate inlets

Measures

Weight 2000 kg
   
Dimensions (W x H x D) 2300 cm x 2700 cm x 1250 cm

Utilities

Power supply 400 VAC, 3 phase with N or 200-210V 3 phase, 50/60 Hz
Fuse 3 x 32 Amps
Power depending on options
   
Vacuum pump Recommendation min. 420 m3/h, mechanical particle trap
   
Carrier gas 99.999 % N2 / Ar, min 2 slm
   
Compressed dry air 5 – 6 bar overpressure
   
Cooling water Only required for the dry vacuum pump and ozone generator, not for the reactor
   
Exhausts Vacuum pump, source cabinets

Options

Cluster tools, automatic loading modules, gas scrubbers, chillers, nitrogen generators, factory host software connectivity