Basic features

Substrate size and type 450 mm wafers in batch up to 40 pieces
300 mm wafers in batch up to 80 wafers
200 mm wafers in batch, 12 x 25 pieces
156 mm x 156 mm solar Si wafers in batches of 800/1000 wafers/run (both sides/ back-to-back)
Up to 400x600 mm glass sheets in batches of 30/50 sheets/run (both sides/ back-to-back)
3D objects (450x450x650 mm), e.g. steel, aluminum, plastic, silverware
Powder and particle substrates
Microchannel plates and through-porous substrates
High-aspect ratio substrates (1000:1)
Process temperature 50 – 500 °C
Substrate loading options Pneumatic loader, robotic loader
Precursors Liquid, solid, gas, ozone
Level sensors, cleaning and refill service
Up to 12 sources with 8 separate inlets


Weight 2000 kg
Dimensions (W x H x D) 230 cm x 270 cm x 125 cm


Power supply 400 VAC, 3 phase with N or 200-210V 3 phase, 50/60 Hz
Fuse 3 x 32 Amps
Power depending on options
Vacuum pump Recommendation min. 420 m3/h, mechanical particle trap
Carrier gas 99.999 % N2 / Ar, min 2 slm
Compressed dry air 5 – 6 bar overpressure
Cooling water Only required for the dry vacuum pump and ozone generator, not for the reactor
Exhausts Reactor frame, vacuum pump, source cabinets


Cluster tools, automatic loading modules, gas scrubbers, chillers, nitrogen generators, factory host software connectivity