P-1000Basic features |
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| Substrate size and type | 450 mm wafers in batch up to 40 pieces 300 mm wafers in batch up to 80 wafers 200 mm wafers in batch, 12 x 25 pieces 156 mm x 156 mm solar Si wafers in batches of 800/1000 wafers/run (both sides/ back-to-back) Up to 400x600 mm glass wafers in batches of 30/50 wafers/run (both sides/ back-to-back) 3D objects (450x450x650 mm), e.g. steel, aluminum, plastic, silverware Powder and particle substrates Microchannel plates and through-porous substrates High-aspect ratio substrates (1000:1) |
| Process temperature | 50 – 500 °C |
| Substrate loading options | Pneumatic loader, robotic loader |
| Precursors | Liquid, solid, gas, ozone Level sensors, cleaning and refill service Up to 12 sources with 8 separate inlets |
Measures |
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| Weight | 2000 kg |
| Dimensions (W x H x D) | 2300 cm x 2700 cm x 1250 cm |
Utilities |
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| Power supply | 400 VAC, 3 phase with N or 200-210V 3 phase, 50/60 Hz Fuse 3 x 32 Amps Power depending on options |
| Vacuum pump | Recommendation min. 420 m3/h, mechanical particle trap |
| Carrier gas | 99.999 % N2 / Ar, min 2 slm |
| Compressed dry air | 5 – 6 bar overpressure |
| Cooling water | Only required for the dry vacuum pump and ozone generator, not for the reactor |
| Exhausts | Vacuum pump, source cabinets |
Options |
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| Cluster tools, automatic loading modules, gas scrubbers, chillers, nitrogen generators, factory host software connectivity |
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