Basic features

Substrate size and type

300 mm wafers in batches of 10 wafers/run (standard pitch)
200 mm wafers in batches of 25 wafers/run (standard pitch)
156 mm x 156 mm solar Si wafers in batches of 100/200 wafers/run (both sides/ back-to-back)
Up to 300x300 mm glass sheets in batches of 10/20 sheets/run (both sides/ back-to-back)
3D objects, e.g. steel, aluminum, plastic, silverware  
Powder and particle substrates
Microchannel plates and through-porous substrates
High-aspect ratio substrates (1000:1)

Process temperature 50 – 500 °C
Substrate loading options Pneumatic loader, robotic loader
Precursors Liquid, solid, gas, ozone
Level sensors, cleaning and refill service
Up to 6 sources with 4 separate inlets


Weight 400 + 300 kg
Dimensions (W x H x D) 149 cm x 191 cm x 111 cm


Power supply 400 VAC, 3 phase with N or 200-210V 3 phase, 50/60 Hz
Fuse 3 x 16 Amps
Power depending on options
Vacuum pump Recommendation min. 420 m3/h, mechanical particle trap
Carrier gas 99.999 % N2 / Ar, min 2 slm
Compressed dry air 5 – 6 bar overpressure
Cooling water Only required for the dry vacuum pump and ozone generator, not for the reactor
Exhausts Reactor frame, vacuum pump, source cabinets


Cluster tools, automatic loading modules, gas scrubbers, chillers, nitrogen generators, factory host software connectivity, glove box compatibility