Basic features

Substrate size and type Single wafers up to 300 mm diameter
3D objects, e.g. steel, aluminum, plastic, silverware  
Powder and particle substrates
Microchannel plates and through-porous substrates
High-aspect ratio substrates (1000:1)
Process temperature 50 – 500 °C
Substrate loading options Pneumatic loader, robotic loader
Precursors Liquid, solid, gas, ozone
Level sensors, cleaning and refill service
Up to 12 sources with 6 separate inlets


Weight 350 + 200 kg
Dimensions (W x H x D) 149 cm x 191 cm x 111 cm


Power supply 400 VAC, 3 phase with N or 200-210V 3 phase, 50/60 Hz
Fuse 3 x 16 Amps
Power depending on options
Vacuum pump Recommendation min. 420 m3/h, mechanical particle trap
Carrier gas 99.999 % N2 / Ar, min 2 slm
Compressed dry air 5 – 6 bar overpressure
Cooling water Only required for the dry vacuum pump and ozone generator, not for the reactor
Exhausts Reactor frame, vacuum pump, source cabinets


Cluster tools, UHV integration, automatic loading modules, gas scrubbers, chillers, nitrogen generators, factory host software connectivity, glove box compatibility