PICOSUN™ R-series

Manual or semi-automatic processing for research and development

High standard R&D requires the best equipment. PICOSUN™ R-series ALD tools enable the deposition of the highest quality ALD films with excellent uniformity even on the most challenging through-porous, ultra-high aspect ratio, and nanoparticle samples. Highly functional and easily exchangeable precursor sources for liquid, gaseous, and solid chemicals enable particle-free processing of a wide range of materials on wafers, 3D objects, and all nanoscale features.

The unique scalability of the PICOSUN™ R-series tools enables smooth transition of the research results into production with PICOSUN™ P-series ALD systems.

Customer data showing excellent film thickness uniformities achieved on 150/200 mm (6/8”) wafers in PICOSUN™ R-series ALD tools. PEALD = plasma-enhanced ALD process.

Material
Non-uniformity (1σ)
AI2O3 (batch)
0.13 %
SiO2 (batch)
0.77 %
TiO2 0.28 %
ZnO
0.94 %
Ta2O5
1.0 %
HfO2
0.47 %
Pt
3.41 %
TiN
1.10 %
PEALD Al2O3
0.50 %
PEALD AlN
0.62 %
PEALD SiO2 (low-T)
1.10 %
PEALD TiN
2.16 %
PEALD TiAlN
2.87 %
PEALD In2O3
0.87 %
PEALD ZnO
2.64 %


Follow the links below for technical features of the PICOSUN™ R-series ALD systems:

PICOSUN™ R-200 Standard technical features

PICOSUN™ R-200 Advanced technical features

For further information and quote please contact sales@picosun.com.