ESPOO, Finland, 21st October, 2014 – Picosun Oy, the leading provider of high quality Atomic Layer Deposition (ALD) equipment and solutions for industrial production, introduces significant improvements for MEMS (MicroElectroMechanical Systems) manufacturing.
Picosun’s ALD technology has been proven to work especially well to form efficient isolation layers for piezoelectric structures. When electricity is applied on piezo materials, it induces movement (and vice versa). Nowadays MEMS manufacturers are amongst the forerunners to integrate these materials into their products, for example inkjet heads, optical focusing and mobile phone components, to utilize this feature. Performance enhancement of piezoelectric materials with PICOSUN™ P-300B-MEMS batch ALD systems has become a standard industrial solution.
“MEMS manufacturers are amongst our most important industrial production customers. We are happy to introduce these novel solutions to them to enable even better and longer-lasting products. The penetration of our technology into these novel, spearheading MEMS applications secures Picosun a central position amongst the leading actors in the European semiconductor industry,” states Juhana Kostamo, Managing Director of Picosun.
Picosun provides the most advanced ALD thin film technology and enables the industrial leap into the future by novel, cutting-edge coating solutions, with four decades of continuous expertise in the field. Today, PICOSUN™ ALD systems are in daily production use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in USA, China, and Singapore, and a world-wide sales and support network.
The process development work for ALD-based structural improvement of piezo materials was performed in the ENIAC Joint Undertaking project EPAMO, running from April 2011 to October 2014 and coordinated by TDK-EPC Corporation.