PICOSUN® Morpher F

    PICOSUN® Morpher F ALD product platform is designed to disrupt the up to 200 mm wafer industries in Beyond and More than Moore technologies. It enables fast, fully automatic, high throughput production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. 

    Technical Features

    Typical substrate size and type
    • 200 mm wafers in batches up to 25 pcs
    • 150 mm wafers in batches up to 25 pcs
    • 100 mm wafers in batches up to 25 pcs
    • High aspect ratio samples (up to 1:2500)
    • Substrate materials: Si, glass, quartz, SiC, GaN, GaAs, LiNbO3, LiTaO3, InP
    Processing temperature and capacity
    • 50 – 300°C
    • Up to 1000 wafers / 24 hours @ 15 nm Al2O3 thickness (cluster with two Morpher units)
    Typical processes
    • Batch processes available with cycle times down to single digit seconds
    • Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, and metals
    • Down to <1% 1σ non-uniformity in a batch (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)
    Substrate loading
    • Fully automatic loading with vacuum cluster tool combined with vertical flip function
    • Cassette to cassette batch loading through fully automatic vacuum cluster system
    • Optional SMIF station
    Key software features
    • Independent recipe editor enabling recipe creation and modification during process runs, with dynamic structure (scalable format for each recipe)
    • Unified interface to control the whole cluster with one communication protocol (Ethercat)
    • Fixed loop control cycle with 1/20 millisecond data logging rate, capable of multi-tasking
    • All data from datalogger fully exportable
    • SECS/GEM integration to factory host
    • Liquid, solid, gas, ozone
    • Level sensors, cleaning and refill service
    • Up to 12 sources with 6 separate inlets

    PICOSUN® Morpher F adapts to the changing needs of your industry and the requirements of your customers, on all business verticals from corporate R&D to production and foundry manufacturing. The leading versatility in substrate materials, substrate and batch size, and the wide process range make Morpher truly a transformable, all-inclusive manufacturing facility to keep you spearheading your industry. It can also be combined with PICOSUN® Morpher P, plasma enhanced ALD single wafer process module, or with PICOSUN® Morpher T, thermal ALD single wafer process module for a maximum of flexibility. 

    PICOSUN® Morpher F is designed for fully automated handling of wafer batches in combination of industry standard single wafer vacuum cluster platforms. Revolutionary, patented wafer batch flipping mechanism enables integration of the system with semiconductor manufacturing lines where most of the processing takes place in horizontal geometry, and the SEMI S2/S8 certification ensures that the system is compatible with the strictest standards of the industry.

    PICOSUN® Morpher F ALD system can be integrated to factory automation via SECS/GEM protocol and the state-of-the-art software offers easy, safe and fail-proof operation of the system through intuitive and streamlined graphical user interface. With our patented dual-chamber, hot-wall reactor design with fully separated precursor conduits and inlets, we create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The compact, ergonomic design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market.

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