PICOSUN® Morpher P

    PICOSUN® P PEALD (Plasma Enhanced Atomic Layer Deposition) system is designed to disrupt the up to 200 mm wafer industries in Beyond and More than Moore technologies. It enables an enhanced process window for demanding production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. 

    Technical Features

    Typical substrate size and type
    • 200 mm and below single wafer
    • High aspect ratio samples (1:50)
    • Substrate materials: Si, glass, quartz, SiC, GaN, GaAs, LiNbO3, LiTaO3, InP
    Processing temperature and capacity
    • 50 – 500°C
    • Single wafer processing with limited backside deposition
    Typical processes
    • Remote plasma assistance to decrease process temperature (vs thermal ALD) without plasma damage due to ion bombardment
    • Al2O3, SiO2, HfO2
    • Down to <1% 1σ non-uniformity thickness (Al2O3
    Substrate loading
    • Fully automatic loading with vacuum cluster tool combined 
    • Cassette to cassette wafer loading through fully automatic vacuum cluster system
    • Optional SMIF station
    Key software features
    • Independent recipe editor enabling recipe creation and modification during process runs, with dynamic structure (scalable format for each recipe)
    • Unified interface to control the whole cluster with one communication protocol (Ethercat)
    • Fixed loop control cycle with 1/20 millisecond data logging rate, capable of multi-tasking
    • All data from datalogger fully exportable
    • SECS/GEM integration to factory host
    • Liquid, solid, gas, ozone
    • Up to 4 plasma gases
    • Level sensors, cleaning and refill service
    • Up to 16 sources with 7 separate inlets

    PICOSUN® Morpher P offers fully automated handling of wafers and an industry standard single wafer vacuum cluster platform. It can be combined with PICOSUN® Morpher F, batch wafer process module, or the PICOSUN® Morpher T, thermal ALD single wafer process module. A state of the art, patented plasma source enables a wide process library without any damage to highly sensitive substrates and/or sub-layers, and the SEMI S2/S8 certification ensures that the system is compatible with the strictest standards of the industry.

    PICOSUN® Morpher P single wafer PEALD system can be integrated to factory automation via SECS/GEM protocol. Our own, proprietary, SEMI-compliant PicoOS™ operating system and process control software allows control of the whole Morpher cluster via one intuitive, userfriendly HMI (human-machine interface) for easy, safe and fail-proof operation, no matter how many process modules of the Morpher family are connected to the cluster. With the patented dual chamber, hot-wall reactor design with fully separated precursor conduits and inlets, it offers the highest quality ALD and PEALD films with excellent yield, low particle levels, and superior electrical and optical performance.

    The compact, ergonomic design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. 

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