PICOSUN® Morpher P

PICOSUN® P PEALD (Plasma Enhanced Atomic Layer Deposition) system is designed to disrupt the up to 200 mm wafer industries in Beyond and More than Moore technologies. It enables an enhanced process window for demanding production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility.

Technical Features

Typical substrate size and type

200 mm and below single wafer
High aspect ratio samples (1:50)
Substrate materials: Si, glass, quartz, SiC, GaN, GaAs, LiNbO₃, LiTaO₃, InP

Processing temperature and capacity

50 – 650°C
Single wafer processing without backside deposition

Typical processes

Remote plasma assistance to decrease process temperature (vs thermal ALD) without plasma damage due to ion bombardment
Al₂O₃, SiO₂, HfO₂, TiN, AlN
Down to <1% 1σ non-uniformity thickness (Al₂O₃)

Substrate loading

Fully automatic loading with vacuum cluster tool combined
Cassette to cassette wafer loading through Picosun Necto™ vacuum cluster system
Optional SMIF station

Key software features

Independent recipe editor enabling recipe creation and modification during process runs, with dynamic structure (scalable format for each recipe)
Unified interface to control the whole cluster with one communication protocol (Ethercat)
Fixed loop control cycle with 1/20 millisecond data logging rate, capable of multi-tasking
Datalogger accessible remotely, all data fully exportable
SECS/GEM integration to factory host

Precursors

Liquid, solid, gas, ozone
Up to 4 plasma gases
Level sensors, cleaning and refill service
Up to 16 sources with 7 separate inlets

PICOSUN® Morpher P offers fully automated handling of wafers and an industry standard single wafer vacuum cluster platform. It can be combined with PICOSUN® Morpher F, batch wafer process module, or the PICOSUN® Morpher T, thermal ALD single wafer process module. A state of the art, patented plasma source enables a wide process library without any damage to highly sensitive substrates and/or sub-layers, and the SEMI S2/S8 certification ensures that the system is compatible with the strictest standards of the industry.

PICOSUN® Morpher P single wafer PEALD system can be integrated to factory automation via SECS/GEM protocol. Our own, proprietary, SEMI-compliant PicoOS™ operating system and process control software allows control of the whole Morpher cluster via one intuitive, userfriendly HMI (human-machine interface) for easy, safe and fail-proof operation, no matter how many process modules of the Morpher family are connected to the cluster. With the patented dual chamber, hot-wall reactor design with fully separated precursor conduits and inlets, it offers the highest quality ALD and PEALD films with excellent yield, low particle levels, and superior electrical and optical performance.

The compact, ergonomic design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. And as a one of its kind, PICOSUN® Morpher P can be connected to an integrated single VCE and robot to make an extremely low footprint, fully automatic tool.