Morpher_T

    PICOSUN® Morpher T

    PICOSUN® Morpher T single wafer ALD system is designed to answer the requirements when quality, control and yield come before anything else, for the 200 mm wafer industries.  It also enables an enhanced process window for demanding production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. 

    Technical Features

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    Typical substrate size and type

    • 200 mm and below single wafer
    • High aspect ratio samples (1:2500)
    • Substrate materials: Si, glass, quartz, SiC, GaN, GaAs, LiNbO3, LiTaO3, InP
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    Processing temperature and capacity
    • 50 – 450°C
    • Single wafer processing without backside deposition
    Typical processes
    • Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, nitrides and metals depending on the tool configuration
    • Down to <0.5% 1σ non-uniformity thickness (Al2O3
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    Substrate loading
    • Fully automatic loading with vacuum cluster tool 
    • Cassette to cassette loading through fully automatic vacuum cluster system
    • Optional SMIF station
    Key software features
    • Independent recipe editor enabling recipe creation and modification during process runs, with dynamic structure (scalable format for each recipe)
    • Unified interface to control the whole cluster with one communication protocol (Ethercat)
    • Fixed loop control cycle with 1/20 millisecond data logging rate, capable of multi-tasking
    • All data from datalogger fully exportable
    • SECS/GEM integration to factory host
    Precursors
    • Liquid, solid, gas, ozone
    • Level sensors, cleaning and refill service
    • Up to 12 sources with 6 separate inlets

    PICOSUN® Morpher T offers fully automated handling of wafers and an industry standard single wafer vacuum cluster platform. It can also be combined with PICOSUN® Morpher F, batch wafer process module, or with PICOSUN® Morpher P, plasma enhanced ALD single wafer process module. The state of the art reaction design enables a wide process library even for demanding processes and demanding applications, without deposition on the backside of the substrate for easy process flow integration. Furthermore, the SEMI S2/S8 certification ensures that the system is compatible with the strictest standards of the industry.

    PICOSUN® Morpher T single wafer thermal ALD system can be integrated to factory automation via SECS/GEM protocol. Our own, proprietary, SEMI-compliant PicoOS™ operating system and process control software allows control of the whole Morpher cluster via one intuitive, userfriendly HMI (human-machine interface) for easy, safe and fail-proof operation, no matter how many process modules of the Morpher family are connected to the cluster. The patented dual chamber, hot-wall reactor design with fully separated precursor conduits and inlets, enables the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance.

    The compact, ergonomic design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market.

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