PICOSUN® P-300BV

Technical Features

Typical substrate size and type

200 mm wafers in batches of 25 pcs (standard pitch)
150 mm wafers in batches of 50 pcs (standard pitch)
100 mm wafers in batches of 75 pcs (standard pitch)
100 mm wafers in batches of 100 pcs (standard pitch)
Non-wafer substrates (tailored holders)
High aspect ratio samples (up to 1:2500)

Processing temperature

50 – 450°C

Typical processes

Batch processes available with cycle times down to single digit seconds
Al₂O₃, SiO₂, Ta₂O₅, HfO₂, ZnO, TiO₂, ZrO₂, AlN, TiN, and metals
Down to <1% 1σ non-uniformity in a batch (Al₂O₃, WIW, WTW, B2B, 49 pts, 5mm EE)

Substrate loading

Semi-automatic loading with vertical loaders (one or two loaders)
Optional heating for load lock

Precursors

Liquid, solid, gas, ozone
Level sensors, cleaning and refill service
Up to 8 sources with 4 separate inlets

The PICOSUN® P-300 ALD systems have become the new standard in high volume ALD manufacturing. By integrating our patented hot-wall design with fully separated inlets, we can create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The agile design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. Our proprietary Picoflow™ diffusion enhancer technology enables highly conformal coatings on ultra-high aspect ratio substrates with production-proven processes.

The PICOSUN® P-300BV ALD system represents the cutting-edge of industrial ALD. The system is designed for semi-automated handling of wafer batches. The tool is optimized for fast batch production and it can be integrated to factory automation via SECS/GEM option. Vacuum loading system with heating option enables clean processing of sensitive substrates and deposition of materials such as metal nitrides.

The PICOSUN® P-300BV is the ALD system of choice for innovation driven industries.