ALD has become a key process technique in the fabrication of logic devices. At first being used commercially in 45nm node manufacturing, the dependence on ALD has increased manifold today to 10nm nodes and beyond. While the 22nm node typically had 10+ ALD steps, today's 10nm node devices have approx. 70 ALD steps, making the current generation of devices unfathomable without ALD and its benefits – ultrathin (1–5nm), conformal, defect-free films.
Some of the typical applications of ALD in logic are for the deposition of
One of the key strengths of ALD technology is the ability to deposit a wide range of materials that no other single technology can offer. The flexibility and modularity of Picosun tools allow for the deposition of a wide range of materials without compromising on film quality or uniformity which makes them an ideal choice for foundries.
The on-field upgradation of a single wafer tool to a cluster tool allows for easy scalability of processes without the need for heavy initial capital investments. Picosun also provides batch tools in addition to single wafer tools which can increase the throughput significantly for standard processes. The modularity of precursor sources also enables adaptability of foundries to keep up with the latest advancements in new materials as well as precursor chemicals without the need to re-invest in a new tool.
Picosun is also the technological leader when it comes to enabling volume production of 300mm wafers through its latest product – PICOSUN® Sprinter. Compared to vertical furnace reactors typically used for batch ALD processing, Sprinter provides higher film quality with a lower thermal budget, making it suitable for temperature-sensitive devices. At the same time, Sprinter combines very fast process times with smaller batch sizes than in vertical furnaces, which allows greater production flexibility and minimized risk without sacrificing throughput.